8:00 - 9:40
Th1A: Planar Multi-Band Filter Synthesis and Design
Chair: Sanghoon Shin
Chair organization: U.S. Naval Research Laboratory
Co-chair: Laya Mohammadi
Co-chair organization: Qualcomm
Location
151AB
In this session, a filter synthesis-based frequency dependent coupling scheme for dual-band filters in presented. A multi-band differential bandpass filter using common-mode suppression for higher stopband rejection and a multi-band bandpass filter design using a reflected group delay method are featured. Next, an absorptive filter using a complementary duplexer is introduced for a negative group delay response. Finally, a substrate integrated waveguide (SIW) filter is described, giving size reduction for mm-wave applications.
Th1B: Recent Advances in Packaging, Interconnects and Multi-Chip Modules
Chair: Kamal Samanta
Chair organization: Sony
Co-chair: Telesphor Kamgaing
Co-chair organization: Intel
Location
153AB
This session discusses the latest advances in RF and millimeter-wave interconnects and packaging. The first paper focuses on tiled 5G module on LTTC with integrated micro-channels. The second paper discusses micro-coaxial cables for high density integration and 3D interconnects. The third paper focuses on D-band waveguide to CPW transitions. The last two papers focus on novel antenna-based interconnects and on-textile integration.
Th1C: Active Phased Arrays Systems
Chair: Julio Navarro
Chair organization: Boeing
Co-chair: Glenn Hopkins
Co-chair organization: Georgia Tech
Location
156AB
This session highlights innovations in active phased array systems from state-of-the-art industrial and academic recent accomplishments. Scalable and modular phased array systems for communication applications are presented. In particular, phased array systems for satellite communications, 5G, millimeter-wave Gbps applications will be presented.
Th1D: Innovative Systems and Applications
Chair: Kavita Goverdhanam
Chair organization: US Army CERDEC
Co-chair: Rui Ma
Co-chair organization: Mitsubishi Electric
Location
157BC
This session focuses on innovative technologies for system applications. Topics include novel techniques for spectroscopy, wireless connectors for IOT, multifunctional structures, radar sensor and physical layer security technique.
Th1E: Nanoscale Devices for RF to THz Applications
Chair: Luca Pierantoni
Chair organization: Univ. Politecnica delle Marche
Co-chair: Dimitris Pavlidis
Co-chair organization: Florida International Univ.
Location
252AB
Nanoscale devices for RF to THz applications are presented. Ferro-magnetic resonance frequency studies are performed using magnetic nano-wires. A black phosphorus MOSFET is fabricated and characterized for good high frequency performance. A high yield fabrication procedure is discussed for use at 220 GHz. The use of quantum capacitance in graphene is explored for parametric amplifiers and down converters. Inverted scanning microwave microscopy is studied for nanometer-scale imaging in platinum diselenide. Magnetic nano-particles are used for developing a compact band-stop filter.
Th1F: Emerging mm-Wave Transistor Technologies for 5G and DoD Applications
Chair: Jeong-sun Moon
Chair organization: HRL Laboratories
Co-chair: Joe Qiu
Co-chair organization: U.S. ARMY Research Office
Location
254AB
While RF/mmW amplifiers are key elements in modern wireless communications and DoD applications, current RF/mmW amplifier performance has approached near saturation and current practice in amplifier designs requires a trade-off between linearity and efficiency. With 5G on the horizon and DoD RF systems moving to the millimeter-wave regime, novel RF/mmW transistor technologies with extreme linearity and efficiency are highly desirable. This focused session will cover emerging mmW transistor technologies toward 5G wireless applications and DoD applications.
Th1G: Design and Characterization of Wireless Power Transfer Systems
Chair: Paolo Mezzanotte
Chair organization: Università di Perugia
Co-chair: Shigeo Kawasaki
Co-chair organization: JAXA
Location
257AB
Several wireless power transfer systems and innovative test bed for rectantenna characterization are presented in this session. Industrial and space applications are considered, along with a low-power receiver and an experimental platform for non conventional excitations.
Th1H: PA Design Techniques and Baseband Terminations
Chair: Gayle Collins
Chair organization: Obsidian Microwave
Co-chair: John Wood
Co-chair organization: Wolfspeed
Location
259AB
This sessions includes descriptions of novel PA design techniques, such as current mode outphasing and input waveform shaping for high efficiency. The design of baseband terminations is an important and topical subject in high power wideband PA design, and we have three papers describing design, analysis, and implementation of wide bandwidth baseband terminations.
10:10 - 11:50
Th2A: Non-Planar Filters 1
Chair: Ming Yu
Chair organization: CUHK
Co-chair: Vicente Boria
Co-chair organization: Univ. Politècnica de València
Location
151AB
Advances on non-planar filters and multiplexers technologies and design techniques
Th2B: 3D-Printed RF Components and Interconnects
Chair: Valentina Palazzi
Chair organization: Università di Perugia
Co-chair: Weijing SU
Co-chair organization: Google
Location
153AB
This session highlights recent advances in 3D printed RF components and interconnects. A squeezed spherical cavity is presented that uses a rectangular slot for higher order mode suppression. Then an integrated transition between suspended rectangular coaxial lines to rectangular waveguide is shown. Novel interconnects including a laser-enhanced direct-printed CPW line operating up to 110 GHz is demonstrated, while a coaxial-to-two parallel wireline is tested up to 40 GHz. The session concludes with a novel helical-based microstrip transmission line enabling phase implementation in fixed length structures.
Th2C: Beamforming Architectures, Components and Calibration Techniques
Chair: Ahmed Kishk
Chair organization: Concordia Univ.
Co-chair: Roberto Vincenti Gatti
Co-chair organization: Università di Perugia
Location
156AB
This session focuses on techniques for self-test and calibration of phased array systems, interference mitigation for digital arrays, novel components for beam forming and integrated T/R modules.
Th2D: mm-Wave and THz Power Amplifiers
Chair: James Buckwalter
Chair organization: Univ. of California, Santa Barbara
Co-chair: Ed Niehenke
Co-chair organization: Niehenke Consulting
Location
157BC
This session will include papers presenting record results for GaN and InP power amplifiers (PA) as well as new measurement data of PA cells in III-V HEMT technologies at terahertz bands.
Th2E: Measurement at the Limits
Chair: Leonard Hayden
Chair organization: Qorvo
Co-chair: Matt King
Co-chair organization: HRL Laboratories
Location
252AB
This session includes THz calibration elements, probes for differential sub-THz and dielectric waveguide, and systems for extreme impedance measurement. The session concludes with an analysis of bias in Monte Carlo uncertainty evaluation. This is a joint IMS/ARFTG session
Th2F: Advances in CMOS, and HBT Technologies for Monolithic ICs
Chair: Tony Ivanov
Chair organization: U.S. Army
Co-chair: Cynthia Hang
Co-chair organization: Raytheon
Location
254AB
Advances in silicon frequency discriminator circuits, substrate parasitics reduction and InP/GaAs HBT microwave monolithic ICs.
Th2G: Microwave and mm-Wave Wireless Energy Harvesting
Chair: Luca Roselli
Chair organization: Univ. of Perugia
Co-chair: Quenton Bonds
Co-chair organization: NASA
Location
257AB
Recent advanced in rectenna and rectenna systems, such as millimeter differential rectifier in CMOS technology and high gain and large beamwidth harvsters with Iot and 5G applications.
Th2H: Load-Modulated Power Amplifiers
Chair: Paul Draxler
Chair organization: Qualcomm
Co-chair: Zoya Popović
Co-chair organization: Univ. of Colorado
Location
259AB
Load-modulated PAs enable higher efficiency at back-off. This can be achieved through 2-way or N-way Doherty or other non-isolated output combiner networks. Low-power CMOS through high-power GaN and LDMOS implementations are presented over various bandwidths below 6GHz.
13:30 - 15:10
THIF1: Interactive Forum Session - Thursday Afternoon - “Named in Honor of Terry Oxley”
Chair: Nestor Lopez
Chair organization: MIT Lincoln Laboratory
Co-chair: Patrick Bell
Co-chair organization: MIT Lincoln Laboratory
Location
253ABC
Th3A: Non-Planar Filters 2
Chair: Giuseppe Macchiarella
Chair organization: Politecnico di Milano
Co-chair: Miguel Laso
Co-chair organization: Universidad Pública de Navarra
Location
151AB
Advances on non-planar filters technologies and design techniques
Th3B: 3D Printed Wireless Modules and Systems
Chair: Matt Tyhach
Chair organization: Raytheon
Co-chair: Dominique Baillargeat
Co-chair organization: XLIM (UMR 7252)
Location
153AB
This session features papers that focus on novel RF components and modules that have been realized using additive manufacturing techniques. One paper focuses on an origami frequency selective surface structure that is integrated with thermal actuation mechanisms. A second origami design is based on a 3D-printed foldable substrate. The third paper is a microfluidics-based 3D-printed Butler matrix in coaxial technology. The session concludes with a demonstration of an embedded-on-package 5G energy harvester system.
Th3E: The Art of Large Signal Measurement and Calibration
Chair: Tibault Reveyrand
Chair organization: XLIM (UMR 7252)
Co-chair: Alfred Riddle
Co-chair organization: Quanergy Systems
Location
252AB
This session includes MIMO antenna array characterizations, GaN transistor transient measurements, a calibration method for oscilloscope using a large signal network analyzer (LSNA), and a phase calibration improvement for the LSNA. This is a joint IMS/ARFTG session
Th3F: GaN Semiconductor Devices and Monolithic ICs
Chair: Ali Darwish
Chair organization: U.S. Army
Co-chair: Nicholas Kolias
Co-chair organization: Raytheon
Location
254AB
Advanced gallium nitride devices and MMICs are presented including GaN/Diamond technology, and mm-Wave GaN switches, phase-shifters, and amplifiers.
Th3G: Novel Techniques and Applications for Near Field Wireless Power Transfer
Chair: Kenjiro Nishikawa
Chair organization: Kagoshima Univ.
Co-chair: Costas Sarris
Co-chair organization: Univ. of Toronto
Location
257AB
Systems designed over a broad frequency range are introduced in the presence of lossy media such as sea water and biological issuee. Single-band and multi-band solutions are proposed employing machine learning approach