8:00 - 9:40
We1A: Power Combiners and Transformers
Chair: Guoan Wang
Chair organization: Univ. of South Carolina
Co-chair: Bayaner Arigong
Co-chair organization: Washington State Univ.
Location
151AB
In this session, wideband, reconfigurable, compact, and multiway power dividers, baluns, and magic-T are proposed and implemented with applied novel techniques including folded inductor on CMOS, defected ground structure, self-packaged SISL, and compensation shield structure for emerging 5G, WLAN, and multiband wireless communication systems applications.
We1B: Oscillator Analysis, Power Amplifier Design, and MIMO System Characterization
Chair: Anding Zhu
Chair organization: Univ. College Dublin
Co-chair: Christopher Silva
Co-chair organization: Aerospace
Location
153AB
This session will present advanced analysis, design, and characterization techniques related to nonlinear circuits and systems for wireless communications, including oscillators, power amplifiers and MIMO transceivers.
We1C: Enabling Technologies for mm-Wave 5G Communication
Chair: Farshid Aryanfar
Chair organization: Peregrine Semiconductor
Co-chair: Jon Comeau
Co-chair organization: Anokiwave
Location
156AB
This session presents latest development on various aspect of mm-Wave technologies to enable 5G communication. It starts with a discussion on predistortion at array level and follow up with presenting phased array performance at 5G primary bands (28 and 39 GHz) and we conclude the session by a tri-band transmitter covering cellular and wifi mm-wave bands.
We1D: mm-Wave and THz Systems for Sensing and Communications
Chair: Adrian Tang
Chair organization: Univ. of California, Los Angeles
Co-chair: Joachim Oberhammer
Co-chair organization: KTH
Location
157BC
This session presents recent advances in mm-wave and THz systems
from 60 GHz to 500 GHz for communication and sensing applications.
We1F: Microwave Acoustic Components and Applications
Chair: Amelie Hagelauer
Chair organization: FAU Erlangen-Nürnberg
Co-chair: Steven Stitzer
Co-chair organization: Northrop Grumman
Location
254AB
Microwave Acoustic Resonators and Filters are key components in the RF frontend carrier aggreation architectures in mobile phones for frequency duplexing and filtering. Laterally excited bulk wave and fin bulk resonators are attractive for 5G applications. For full-duplex architectures non-reciprocal acoustic filters and acoustic delay-element-based sequentially switched delay-line circulators are presented. Finally, tunable frequency agile resonators are presented with a potential to reduce the ever increasing complexity of the RF frontends.
We1G: Recent Advances in Radar Systems Applications
Chair: Martin Vossiek
Chair organization: FAU Erlangen-Nürnberg
Co-chair: Arne Jacob
Co-chair organization: Handong Univ.
Location
257AB
Advances in technologies that enable radar systems will be discussed. Recent advances are described in algorithms and processing for 2D imaging, distance measurements, and real-time radar. Advances that apply to cooperative, 3D imaging and lower cost radar systems are included.
We1H: Advanced GaN Power Amplifiers
Chair: Jonmei Yan
Chair organization: MaXentric Technologies
Co-chair: Wenhua Chen
Co-chair organization: Tsinghua Univ.
Location
259AB
This session covers new developments in high efficiency GaN amplifiers from UHF through Ka-band. Recent advances in Doherty/outphasing architectures will be presented.
10:10 - 11:50
WEIF1: Interactive Forum Session - Wednesday Morning - “Named in Honor of Barry Perlman”
Chair: Kenneth Kolodziej
Chair organization: MIT Lincoln Laboratory
Co-chair: Nestor Lopez
Co-chair organization: MIT Lincoln Laboratory
Location
253ABC
We2A: Advances in Passive Components
Chair: Holger Maune
Chair organization: Technische Univ. Darmstadt
Co-chair: Hualiang Zhang
Co-chair organization: UMass Lowell
Location
151AB
This session presents the latest results in passive components. The topics range from material level to the component level. Novel methods to implement classic components such as switches, phase shifters, circulators and hybrids are discussed in this session. The session features four papers. Wide-bandwidth designs and low-loss designs are realized in different technologies, such as printed circuit boards and waveguides.
We2B: Nonlinear Modeling Methods for Novel Microwave Components
Chair: Shahed Reza
Chair organization: Sandia National Laboratories
Co-chair: Matthias Rudolph
Co-chair organization: Brandenburgische Technische Universität
Location
153AB
Novel modeling methods for nonlinear microwave devices will be covered in this session. The session begins with papers on ferrimagnetic frequency-selective limiters. Nonlinear AlGaN/GaN HEMT and varactor modeling methods are then presented. The session closes with a multi-box mixer model and its validation.
We2C: 5G Technologies and Evaluation Techniques
Chair: Vittorio Camarchia
Chair organization: Politecnico di Torino
Co-chair: Debabani Choudhury
Co-chair organization: Intel
Location
156AB
Different aspects of 5G technologies, design and measurement techniques are presented. The talks include GaN-on-Si and BiCMOS PAs; self-interference cancellers; and 5G measurement techniques.
We2D: mm-Wave Building Blocks and Transceivers
Chair: William Deal
Chair organization: Northrop Grumman
Co-chair: Theodore Reck
Co-chair organization: Virginia Diodes
Location
157BC
Technology capabilities of advanced silicon-based and III/V processes are rapidly improving and enable transceivers at mm-Wave frequencies.
Circuit techniques and technology demonstration will be presented in this session.
We2F: Phase Change, Ferroelectric and Ferrite Control Devices
Chair: Thomas Lingel
Chair organization: Anaren
Co-chair: Amir Mortazawi
Co-chair organization: Univ. of Michigan
Location
254AB
This session includes the latest advances in control materials for RF front-ends including application of phase change, thin-film ferroelectric and ferrites for switches matrices, duplexers and frequency selective limiters and switchable stacked crystal filters.
We2G: Advances in Broadband Transceiver Chips for Radar and Communication Systems
Chair: Rudy Emrick
Chair organization: Northrop Grumman
Co-chair: Mohamed Abouzahra
Co-chair organization: MIT Lincoln Laboratory
Location
257AB
Recent advances in broadband transceiver chips for both radar and communications systems will be highlighted. Advances include higher levels of integration in low-cost CMOS, moving towards massive MIMO and advances for contactless communications utilizing plastic waveguide.
We2H: Wideband GaN Power Amplifiers
Chair: Charles Campbell
Chair organization: Qorvo
Co-chair: Rüdiger Quay
Co-chair organization: Fraunhofer IAF
Location
259AB
This session describes wide bandwidth design techniques and circuit examples. Two papers present state-of-the-art distributed power amplifiers. The remaining papers in the session describe high-efficiency design techniques.
15:55 - 17:15
WEIF2: Interactive Forum Session - Wednesday Afternoon - “Named in Honor of Larry Whicker”
Chair: Nestor Lopez
Chair organization: MIT Lincoln Laboratory
Co-chair: Ekaterina Kononov
Co-chair organization: MIT Lincoln Laboratory
Location
253ABC
We3A: Substrate-Integrated Waveguide Bandpass Filters
Chair: Dimitra Psychogiou
Chair organization: Univ. of Colorado
Co-chair: Masud Hannan
Co-chair organization: Intel
Location
151AB
This session will provide an overview of recent research findings on the realization of substrate integrated waveguide (SIW)-based bandpass filters for a wide range of applications covering frequencies as low as wireless LAN to millimeter-wave bands. The session will focus on both new design aspects as well as novel integration schemes.
We3B: Multi-GHz CMOS Mixed-Signal Circuits and Systems
Chair: Christian Carlowitz
Chair organization: FAU Erlangen-Nürnberg
Co-chair: Markus Gardill
Co-chair organization: InnoSenT
Location
153AB
This session addresses advances in mixed-signal circuits and systems. The first two presentations cover stacked CMOS topology for higher output voltage, while maintaining the RF performance in terms of bandwidth and speed for optical modulator drivers and all-digital transmitters. The other two papers introduce an inductorless high-speed digital logic family for ADCs and a near-field inductively coupled high-speed digital interconnect concept.
We3C: High-Capacity Wireless Communication Systems
Chair: Kenneth Kolodziej
Chair organization: MIT Lincoln Laboratory
Co-chair: Zaher Bardi
Co-chair organization: Retired
Location
156AB
This session presents the newest developments in wireless communication RF front-end and system architectures that results in high capacity. This includes approaches taking advantage of broad bandwidth, high spectral efficiency modulations and spatial diversity. In particular, millimeter wave, MIMO and beamforming communication systems will be discussed.
We3D: Microwave-through-THz Photonics Devices and Systems
Chair: Jeffrey Nanzer
Chair organization: Michigan State Univ.
Co-chair: Mona Jarrahi
Co-chair organization: Univ. of California, Los Angeles
Location
157BC
This session presents recent advances in device and system technologies for emission, modulation, and detection of microwave and THz signals. Presentations will show novel THz source and detector architectures for advanced communication and spectroscopy, microwave-photonics devices for improved modulation bandwidth, and enhanced transmit and receive capabilities.
We3F: Advanced MEMS Component Technologies, Characterization Techniques and Packaging
Chair: Songbin Gong
Chair organization: Univ. of Illinois at Urbana-Champaign
Co-chair: Matthew Morton
Co-chair organization: Raytheon
Location
254AB
This session covers advanced MEMS resonators, oscillators, and impedance tuners, as well as linearity measurement techniques well-suited to the high linearity performance achieved by MEMS switch technology. It discusses solutions that use a range of materials such as ScAIN, silicon-ceramic composite substrates, silicon-on-insulator substrates, and commercially-available components.
We3G: Recent Advances in Non-Destructive Microwave Near-Field Sensing
Chair: Xun Gong
Chair organization: Univ. of Central Florida
Co-chair: Venkata Chivukula
Co-chair organization: Qualcomm
Location
257AB
This session focuses on recent research on non-destructive microwave sensing of material properties for a variety of applications, including near-field imaging, dielectric spectroscopy, eye tracking, and fluid-leakage detection.